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On Oct 1, 2008 Pei (and others) published: Grinding of silicon wafers: A review from historical perspectives
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Grinding/polishing machine for silicon block, and method of working silicon wafer Info Publication number JPA
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Information on Wafer Edge Grinding Machine: WGM4200 can be found.
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International Journal of Machine Tools Manufacture 41 (2001) 659–672 Fine grinding of silicon wafers Pei a,*, Alan Strasbaugh b a Department of Industrial ...
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